Laser Micromachining Systems for the Industrial Production of Electronic Devices

Jun
27
2019

Laser In Der Mikroelektronik: The Future Is Digital

27. Jun 2019
10:00-10:20 Uhr  |  Halle A3 Stand A3.545

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Themen: 

Lasersysteme für die Fertigung

Sprecher: 

Dr. Hans Ulrich Zuehlke 

(3D Micromac AG)

Format:
Vortrag
Vortragssprache: Englisch
Chairman: Rainer Pätzel (Coherent LaserSystems GmbH & Co. KG) | Dr. Dietmar Kracht (Laser Zentrum Hannover e.V. (LZH))

In the manufacturing of electronic components, precision and machining quality on ever-smaller structures are playing an important role.
The presentation will give a brief overview of different 3D-Micromac production solutions where laser processing achieve new dimensions in terms of precision, quality and process efficiency. The main focus is on a new selective laser annealing system designed to enable ohmic contact formation for SiC power devices.
A new challenge for the OCF process is the trend to ever-thinner wafers in order to further reduce the electrical resistance in the component and to improve the heat conduction. At the same time, however, the distance between the back side of the wafer to be heated to the thermally sensitive front side decreases. A traditional OCF process with a flash lamp may create a thermally damage the front side of the wafer. The remedy is to replace the flash lamp with selective laser annealing. In the process, the back side of the wafer is irradiated by laser. This guarantees a sufficient silicide formation with improvement of the quality of the NixSiy interface and minimizes the heat conduction towards the front side of the wafer. The structure on the front side is not even damaged by laser processing.

Sprecher
Dr. Hans Ulrich Zuehlke, 3D Micromac AG Profil anzeigen

Lageplan
Freigelände
EingangNord-Ost
EingangNord-West
EingangNord
ConferenceCenter Nord
ICM -InternationalesCongressCenterMünchen
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EingangWest
Atrium
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EingangOst
EingangNord-West
EingangNord
Freigelände
EingangNord-Ost
ConferenceCenter Nord
ICM
B0
C1
C2
C3
C4
C5
C6
B1
B2
B3
B4
B5
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EingangWest
Atrium
EingangOst
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Jun
27
2019

Laser In Der Mikroelektronik: The Future Is Digital

Precision Laser Processing Enables Advanced Flat Panel Display Manufacturing

27. Jun 2019
11:20-11:40 Uhr  |  Halle A3 Stand A3.545
Chairman: Rainer Pätzel (Coherent LaserSystems GmbH & Co. KG), Dr. Dietmar Kracht (Laser Zentrum Hannover e.V. (LZH))
Sprecher: Dr. Dirk Müller (Coherent Inc.)

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Jun
27
2019

Laser In Der Mikroelektronik: The Future Is Digital

Thermal Effect free Ultrashort Pulse Laser Machining of Display Materials

27. Jun 2019
11:00-11:20 Uhr  |  Halle A3 Stand A3.545
Chairman: Rainer Pätzel (Coherent LaserSystems GmbH & Co. KG), Dr. Dietmar Kracht (Laser Zentrum Hannover e.V. (LZH))
Sprecher: Jong Kab Park (AP-Systems)

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Jun
27
2019

Laser In Der Mikroelektronik: The Future Is Digital

Laser Processing for Advanced Packaging Applications

27. Jun 2019
10:40-11:00 Uhr  |  Halle A3 Stand A3.545
Chairman: Rainer Pätzel (Coherent LaserSystems GmbH & Co. KG), Dr. Dietmar Kracht (Laser Zentrum Hannover e.V. (LZH))
Sprecher: Markus Arendt (SUSS MicroTec)

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Jun
27
2019

Laser In Der Mikroelektronik: The Future Is Digital

Modular Laser Technology enables Flexible Laser Applications

27. Jun 2019
11:40-12:00 Uhr  |  Halle A3 Stand A3.545
Chairman: Rainer Pätzel (Coherent LaserSystems GmbH & Co. KG), Dr. Dietmar Kracht (Laser Zentrum Hannover e.V. (LZH))
Sprecher: Dr. Maik Frede (neoLASE GmbH)

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Jun
27
2019

Laser In Der Mikroelektronik: The Future Is Digital

Speakers Corner

27. Jun 2019
12:00-12:20 Uhr  |  Halle A3 Stand A3.545
Chairman: Rainer Pätzel (Coherent LaserSystems GmbH & Co. KG), Dr. Dietmar Kracht (Laser Zentrum Hannover e.V. (LZH))

Weitere Informationen in der Detailansicht:
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o Pressekontakt
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