Laser Processing for Advanced Packaging Applications

Jun
27
2019

Laser In Der Mikroelektronik: The Future Is Digital

27. Jun 2019
10:40-11:00 Uhr  |  Halle A3 Stand A3.545

Weitere Informationen in der Detailansicht:
o Anhänge
o Pressekontakt
o Alternative Termine

Details

Themen: 

Lasersysteme für die Fertigung

Sprecher: 

Markus Arendt 

(SUSS MicroTec)

Format:
Vortrag
Vortragssprache: Englisch
Chairman: Rainer Pätzel (Coherent LaserSystems GmbH & Co. KG) | Dr. Dietmar Kracht (Laser Zentrum Hannover e.V. (LZH))

Lasers find more and more use in optical debonding, µ-via drilling, RDL structuring, seed layer removal, soldering, annealing, or laser assisted bonding. This is driven from multiple sides: technically, by a continuous need for higher density routing and heterogeneous integration of different devices, from a quality standpoint by a need for further increasing reliability, and commercially for continuous cost reduction. Lasers hereby play an important role by creating intricate features with low damage to surrounding material, enabling a wider selection of materials and processes, and enabling a reduction in process steps.

We will present applications in Advanced Packaging and 3D Integration that benefit from the use of lasers. Laser debonding is the perfect solution for processing thin and ultra-thin wafers with almost no thermal impact. Using lasers for creating an embedded RDL redistribution layer in a dual-damascene approach halves the number of process steps, allows wider material selection, and increases integrity and reliability in fine routings < 2/2um L/S. Other applications such as µ-via drilling and dry metal removing are discussed. Results of the technical characterization and process experiences are shared.

Sprecher
Markus Arendt, SUSS MicroTec Profil anzeigen

Lageplan
Freigelände
EingangNord-Ost
EingangNord-West
EingangNord
ConferenceCenter Nord
ICM -InternationalesCongressCenterMünchen
B0
C1
C2
C3
C4
C5
C6
B1
B2
B3
B4
B5
B6
EingangWest
Atrium
A1
A2
A3
A4
A5
A6
EingangOst
EingangNord-West
EingangNord
Freigelände
EingangNord-Ost
ConferenceCenter Nord
ICM
B0
C1
C2
C3
C4
C5
C6
B1
B2
B3
B4
B5
B6
EingangWest
Atrium
EingangOst
A1
A2
A3
A4
A5
A6
Jun
27
2019

Laser In Der Mikroelektronik: The Future Is Digital

Precision Laser Processing Enables Advanced Flat Panel Display Manufacturing

27. Jun 2019
11:20-11:40 Uhr  |  Halle A3 Stand A3.545
Chairman: Rainer Pätzel (Coherent LaserSystems GmbH & Co. KG), Dr. Dietmar Kracht (Laser Zentrum Hannover e.V. (LZH))
Sprecher: Dr. Dirk Müller (Coherent Inc.)

Weitere Informationen in der Detailansicht:
o Anhänge
o Pressekontakt
o Alternative Termine

Details
Jun
27
2019

Laser In Der Mikroelektronik: The Future Is Digital

Thermal Effect free Ultrashort Pulse Laser Machining of Display Materials

27. Jun 2019
11:00-11:20 Uhr  |  Halle A3 Stand A3.545
Chairman: Rainer Pätzel (Coherent LaserSystems GmbH & Co. KG), Dr. Dietmar Kracht (Laser Zentrum Hannover e.V. (LZH))
Sprecher: Jong Kab Park (AP-Systems)

Weitere Informationen in der Detailansicht:
o Anhänge
o Pressekontakt
o Alternative Termine

Details
Jun
27
2019

Laser In Der Mikroelektronik: The Future Is Digital

Laser Micromachining Systems for the Industrial Production of Electronic Devices

27. Jun 2019
10:00-10:20 Uhr  |  Halle A3 Stand A3.545
Chairman: Rainer Pätzel (Coherent LaserSystems GmbH & Co. KG), Dr. Dietmar Kracht (Laser Zentrum Hannover e.V. (LZH))
Sprecher: Dr. Hans Ulrich Zuehlke (3D Micromac AG)

Weitere Informationen in der Detailansicht:
o Anhänge
o Pressekontakt
o Alternative Termine

Details
Jun
27
2019

Laser In Der Mikroelektronik: The Future Is Digital

Modular Laser Technology enables Flexible Laser Applications

27. Jun 2019
11:40-12:00 Uhr  |  Halle A3 Stand A3.545
Chairman: Rainer Pätzel (Coherent LaserSystems GmbH & Co. KG), Dr. Dietmar Kracht (Laser Zentrum Hannover e.V. (LZH))
Sprecher: Dr. Maik Frede (neoLASE GmbH)

Weitere Informationen in der Detailansicht:
o Anhänge
o Pressekontakt
o Alternative Termine

Details
Jun
27
2019

Laser In Der Mikroelektronik: The Future Is Digital

Speakers Corner

27. Jun 2019
12:00-12:20 Uhr  |  Halle A3 Stand A3.545
Chairman: Rainer Pätzel (Coherent LaserSystems GmbH & Co. KG), Dr. Dietmar Kracht (Laser Zentrum Hannover e.V. (LZH))

Weitere Informationen in der Detailansicht:
o Anhänge
o Pressekontakt
o Alternative Termine

Details

 
 
 
  • LASER World of PHOTONICS